US Patent 8445927 Light emitting diode package and manufacturing method thereof

Patent 8445927 was granted and assigned to Samsung on May, 2013 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

84459270

Patent Inventor Names

Na Na Park0

Chang Hoon Kwak0

Il Woo Park0

Seong Ah Joo0

Date of Patent

May 21, 2013

Patent Application Number

123602500

Date Filed

January 27, 2009

Patent Citations Received

‌

US Patent 12007081 Lighting assembly and method for manufacturing a lighting assembly

‌

US Patent 11824148 Semiconductor light emitting devices and method of manufacturing the same

Patent Primary Examiner

‌

Marcos D. Pizarro

Patent abstract

The present invention relates to a light emitting diode package and a manufacturing method thereof.

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