Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 28, 2013
Patent Application Number
13050599
Date Filed
March 17, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic assembly is provided, which includes a circuit board, in which a solder pad is disposed at a position close to an end edge on at least one surface of the circuit board, and a depression is disposed between the solder pad and the end edge; and, an electronic element, including an insulating body and a plurality of terminals fixed to the insulating body, in which each of the terminals has a protruding portion and a soldering portion respectively corresponding to the depression and the solder pad. A method for manufacturing the electronic assembly is also provided.
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