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US Patent 8453323 Printed circuit board manufacturing method
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Patent
Date Filed
September 16, 2011
Date of Patent
June 4, 2013
Patent Application Number
13234721
Patent Citations Received
US Patent 12087700 Embedded die microelectronic device with molded component
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
8453323
Patent Primary Examiner
Peter Dungba Vo
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