An attachment device is provided for supporting electrical wiring, communications wiring, and piping having an elongated body with first and second surfaces, opposite faces, and opposite ends. One or more transverse passages extend between the faces permitting passage of wiring and piping therethrough. Mounting passages extending between the first and second surfaces permit securing of the attachment device to a structure using fasteners such as a nails, screws, or bolts. Additionally, adhesives can be located on the second surface for securing the device to a structure.