US Patent 8468837 High efficiency thermoelectric cooling system and method of operation

A high efficiency thermoelectric cooling system and method is described. The cooling system has a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A smooth continuous variable output direct current source supplies the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. Current flow in the semi-conductor body transfers heat from one plate to the other plate. A cold heat sink absorbs heat from the cold plate. A heat convection assembly, including a hot heat sink, evacuates heat from the hot plate. The thermoelectric cooling device is secured to a wall of an insulated enclosure. An air convection housing may b provided to evacuate heat from the hot heat sink using an outside air supply or ambient air supply.