Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ying Chao Yeh0
Shih Hsiung Chan0
Wen Liang Tseng0
Wen Yu Lin0
Chester Kuo0
Lung Hsin Chen0
Peng Yi Wu0
Po Min Tu0
...
Date of Patent
June 25, 2013
0Patent Application Number
127222310
Date Filed
March 11, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.
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