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US Patent 8471376 Integrated circuit packaging configurations
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Patent
Date Filed
May 6, 2010
Date of Patent
June 25, 2013
Patent Application Number
12774908
Patent Citations Received
US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
0
US Patent 11682613 Package substrates with magnetic build-up layers
0
US Patent 11908784 Packaged semiconductor device assembly
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
8471376
Patent Primary Examiner
Mamadou Diallo
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