US Patent 8473056 Assembly method for implantable medical device
Patent 8473056 was granted and assigned to Medtronic on June, 2013 by the United States Patent and Trademark Office.
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Patent abstract
An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
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Patent Inventor Names
Andrew J. Ries0
David B. Engmark0
Gary M. Grose0
Thomas I. Ceballos0
Todd H. Schaefer0
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US Patent 08473056 Assembly method for implantable medical device US Patent 8473056 Assembly method for implantable medical device
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Patent Number
08473056
Patent Number
8473056
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US Patent 08473056 Assembly method for implantable medical device
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Is a
Current assignee
Patent jurisdiction
Patent number
08473056
Date of patent
June 25, 2013
Patent application number
12109838
Date Filed
April 25, 2008
Patent primary examiner
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