Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Steven Mayer0
Zhian He0
Jingbin Feng0
Jonathan Reid0
Seshasayee Varadarajan0
Date of Patent
July 2, 2013
0Patent Application Number
124815030
Date Filed
June 9, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.