US Patent 8480421 Method of integrally molding connector, and object connector

Patent 8480421 was granted and assigned to Yazaki on July, 2013 by the United States Patent and Trademark Office.

Is a

Current Assignee

Patent Jurisdiction

Patent Number

Date of Patent

July 9, 2013

Patent Application Number

13263365

Date Filed

June 18, 2010

Patent Citations Received

Patent Primary Examiner

Patent abstract

There is provided a method of integrally molding a connector in which the number of components can be reduced, and productivity can be enhanced.

No Timeline data yet.

Title

Author

Link

Type

Date

No Further Resources data yet.

Find more entities like US Patent 8480421 Method of integrally molding connector, and object connector

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.