US Patent 8546946 Chip stack package having spiral interconnection strands
Patent 8546946 was granted and assigned to Nanya Technology Corporation on October, 2013 by the United States Patent and Trademark Office.
Is a
Date Filed
April 20, 2011
Date of Patent
October 1, 2013
Patent Application Number
13090281
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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