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US Patent 8562750 Method and apparatus for processing bevel edge

Patent 8562750 was granted and assigned to Lam Research on October, 2013 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Lam Research
Lam Research
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Date Filed
December 17, 2009
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Date of Patent
October 22, 2013
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Patent Application Number
12640926
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Patent Citations Received
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US Patent 11756771 Tunable upper plasma-exclusion-zone ring for a bevel etcher
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US Patent 11946142 Spatially tunable deposition to compensate within wafer differential bow
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US Patent 11948790 Heater support kit for bevel etch chamber
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US Patent 11851760 PECVD deposition system for deposition on selective side of the substrate
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8562750
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Patent Primary Examiner
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Michael Kornakov
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