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US Patent 8563358 Method of producing a chip package, and chip package

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United States Patent and Trademark Office

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Patent Number

Date of Patent

October 22, 2013

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Patent Application Number

132759880

Date Filed

October 18, 2011

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Patent Citations Received

US Patent 11764122 3D flex-foil package

US Patent 12111207 Despeckling in optical measurement systems

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US Patent 12111210 Light source modules for noise mitigation

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