US Patent 8569887 Post passivation interconnect with oxidation prevention layer
Patent 8569887 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2013 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 19, 2010
0
Date of Patent
October 29, 2013
0
Patent Application Number
12907249
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Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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