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US Patent 8580607 Microelectronic packages with nanoparticle joining

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 27, 2010
Date of Patent
November 12, 2013
Patent Application Number
12844463
Patent Citations Received
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
0
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8580607
Patent Primary Examiner
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A. Sefer

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