US Patent 8609471 Packaging an integrated circuit die using compression molding
Patent 8609471 was granted and assigned to Freescale Semiconductor on December, 2013 by the United States Patent and Trademark Office.
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US Patent 08609471 Packaging an integrated circuit die using compression molding US Patent 8609471 Packaging an integrated circuit die using compression molding
Infobox
Patent Number
086094710
Patent Number
86094710
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
086094710
Date of Patent
December 17, 2013
0Patent Application Number
120399130
Date Filed
February 29, 2008
0Patent Primary Examiner
Edits on 21 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 08609471 Packaging an integrated circuit die using compression molding
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08609471
Date of patent
December 17, 2013
Patent application number
12039913
Date Filed
February 29, 2008
Patent primary examiner
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