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US Patent 8611055 Magnetic etch-stop layer for magnetoresistive read heads
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Edits on 22 May, 2024
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Golden AI
edited on 22 May, 2024
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Patent Citations Received
US Patent 11990410 Top via interconnect having a line with a reduced bottom dimension
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Edits on 17 Apr, 2024
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Golden AI
edited on 17 Apr, 2024
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US Patent 11961759 Interconnects having spacers for improved top via critical dimension and overlay tolerance
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Edits on 9 Feb, 2024
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Golden AI
edited on 9 Feb, 2024
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US Patent 11894265 Top via with damascene line and via
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Edits on 12 Jan, 2024
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Golden AI
edited on 12 Jan, 2024
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US Patent 11869808 Top via process with damascene metal
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Edits on 1 Nov, 2023
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Golden AI
edited on 1 Nov, 2023
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US Patent 11804406 Top via cut fill process for line extension reduction
Edits on 24 May, 2023
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Golden AI
edited on 24 May, 2023
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US Patent 08611055 Magnetic etch-stop layer for magnetoresistive read heads
US Patent 8611055 Magnetic etch-stop layer for magnetoresistive read heads
Infobox
Patent Number
08611055
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Patent Number
8611055
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Edits on 4 Apr, 2023
"Entity importer update"
Golden AI
edited on 4 Apr, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
08611055
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Date of Patent
December 17, 2013
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Patent Application Number
12534091
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Date Filed
July 31, 2009
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Patent Primary Examiner
David D Davis
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Edits on 21 Dec, 2021
"Created via: Entity Importer"
Golden AI
created this topic on 21 Dec, 2021
Edits made to:
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+7
properties)
US Patent 08611055 Magnetic etch-stop layer for magnetoresistive read heads
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08611055
Date of patent
December 17, 2013
Patent application number
12534091
Date Filed
July 31, 2009
Patent primary examiner
David D Davis
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