Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Wei Chen0
Date of Patent
January 7, 2014
0Patent Application Number
128427310
Date Filed
July 23, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit structure includes a semiconductor chip, which includes a corner, a side, and a center. The semiconductor chip further includes a plurality of bump pad structures distributed on a major surface of a substrate; a first region of the substrate having formed thereon a first bump pad structure having a first number of supporting metal pads associated with it; and a second region of the substrate having formed thereon a second bump structure having a second number of supported metal pads associated with it, the second number being greater than the first number.
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