US Patent 8628173 Electrical interconnect using embossed contacts on a flex circuit

A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit substrate make electrical connection to at least some of the array of transducers, the flexible circuit substrate being embossed so that the contact pads extend out of a plane of the flexible circuit substrate.