Patent attributes
The invention relates to a method for bonding a first surface (1a) and a second surface (7a) by means of an interlayer (3), comprising the steps:a) providing a first item (1) which has the first surface (1a),b) providing flowable, solidifiable material for the interlayer (3),c) providing a second item (7) which has the second surface (7a),d) applying the material for the interlayer onto the first surface (1a) so that a bulge (3a) encircling the surface is produced,e) applying a vacuum around the first item (1) and the second item (2),f) bringing the second surface (7a) of the second item (7) into contact with the circumferential bulge so that a sealed-off cavity (5) is produced,g) increasing the ambient pressure so that the cavity (5) is eliminated without resulting in a stream of gas flowing into the cavity andh) increasing the viscosity of the material for the interlayer.
