US Patent 8642483 Substrate processing with shrink etching step
Patent 8642483 was granted and assigned to Tokyo Electron on February, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 19, 2010
0
Date of Patent
February 4, 2014
0
Patent Application Number
12709016
0
Patent Citations Received
Patent Inventor Names
Masanobu Honda
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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