US Patent 8648454 Wafer-scale package structures with integrated antennas
Is a
Date Filed
February 14, 2012
0
Date of Patent
February 11, 2014
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Patent Application Number
13396030
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Patent Inventor Names
Duixian Liu
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Jean-Olivier Plouchart
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Scott K. Reynolds
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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