Implant release apparatus includes a connector connecting a lead having an electrolytically erodible portion and a restraint that restrains the implant. In one embodiment, the connector can include or comprise a nonconductive member.
US Patent 08657870 Implant delivery apparatus and methods with electrolytic releaseUS Patent 8657870 Implant delivery apparatus and methods with electrolytic release
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Patent Number
086578700
Patent Number
86578700
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