Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Jiun Yi Wu0
Date of Patent
April 15, 2014
0Patent Application Number
127842980
Date Filed
May 20, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An under-bump metallization (UBM) structure for a substrate, such as an organic substrate, a ceramic substrate, a silicon or glass interposer, a high density interconnect, a printed circuit board, or the like, is provided. A buffer layer is formed over a contact pad on the substrate such that at least a portion of the contact pad is exposed. A conductor pad is formed within the opening and extends over at least a portion of the buffer layer. The conductor pad may have a uniform thickness and/or a non-planar surface. The substrate may be attached to another substrate and/or a die.
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