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US Patent 8704368 Stackable via package and method
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Patent
Date Filed
June 20, 2012
Date of Patent
April 22, 2014
Patent Application Number
13528206
Patent Citations Received
US Patent 11961805 Devices and methods related to dual-sided radio-frequency package with overmold structure
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US Patent 11700692 Stackable via package and method
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Patent Inventor Names
Mahmoud Dreiza
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Curtis Michael Zwenger
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Akito Yoshida
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Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
8704368
Patent Primary Examiner
Jeremy Norris
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