Patent attributes
A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.
