Patent attributes
A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.
