US Patent 8710639 Semiconductor element-embedded wiring substrate
Patent 8710639 was granted and assigned to NEC Corporation on April, 2014 by the United States Patent and Trademark Office.
Is a
Date Filed
February 22, 2011
Date of Patent
April 29, 2014
Patent Application Number
13639735
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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