Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 29, 2014
Patent Application Number
11677477
Date Filed
February 21, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent the single edge, connecting the die pads and the first bonding lands, and encapsulating the die pads and a portion of the first bonding lands to form a first package.
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