US Patent 8765578 Edge protection of bonded wafers during wafer thinning
Is a
Date Filed
June 6, 2012
Date of Patent
July 1, 2014
Patent Application Number
13489861
Patent Citations Received
Patent Inventor Names
Kevin R. Winstel
0
Douglas C. La Tulipe, Jr.
0
Spyridon Skordas
0
Tuan A. Vo
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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