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US Patent 8772130 Manufacturing method of SOI substrate
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Edits on 11 Sep, 2024
"update inverses"
Golden AI
edited on 11 Sep, 2024
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Patent Citations Received
US Patent 12087866 Semiconductor device, method for manufacturing semiconductor device, module, and electronic device
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Edits on 29 Mar, 2024
"update inverses"
Golden AI
edited on 29 Mar, 2024
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Patent Citations Received
US Patent 11942554 Semiconductor device, display device including the semiconductor device, and an electronic device including the semiconductor device
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"update inverses"
Golden AI
edited on 29 Mar, 2024
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Patent Citations Received
US Patent 11942497 Imaging device and electronic device
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Edits on 26 Sep, 2023
"Add patent inventor(s)"
Golden AI
edited on 26 Sep, 2023
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Patent Inventor Names
Hiroshi Ohki
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Edits on 25 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 25 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=08772130
Edits on 17 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 17 May, 2023
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US Patent 08772130 Manufacturing method of SOI substrate
US Patent 8772130 Manufacturing method of SOI substrate
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Patent Number
08772130
Patent Number
8772130
Edits on 19 Jun, 2022
"Entity importer update"
Golden AI
edited on 19 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08772130
Edits on 24 Dec, 2021
"Created via: Entity Importer"
Golden AI
created this topic on 24 Dec, 2021
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US Patent 08772130 Manufacturing method of SOI substrate
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Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08772130
Date of patent
July 8, 2014
Patent application number
13589704
Date Filed
August 20, 2012
Patent primary examiner
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