US Patent 8772946 Reduced stress TSV and interposer structures

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8772946

Patent Inventor Names

Kishor V. Desai0

Terrence Caskey0

Belgacem Haba0

Charles G. Woychik0

Craig Mitchell0

Cyprian Emeka Uzoh0

Huailiang Wei0

Date of Patent

July 8, 2014

Patent Application Number

13492064

Date Filed

June 8, 2012

Patent Citations Received

‌

US Patent 12074092 Hard IP blocks with physically bidirectional passageways

Patent Primary Examiner

‌

Fernando Toledo

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