US Patent 8772949 Enhanced capture pads for through semiconductor vias

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Patent Jurisdiction

Patent Number

Patent Inventor Names

Mukta G. Farooq0

Richard P. Volant0

Gary Lafontant0

John A. Griesemer0

Kevin S. Petrarca0

Date of Patent

July 8, 2014

Patent Application Number

136706940

Date Filed

November 7, 2012

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