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US Patent 8778738 Packaged semiconductor devices and packaging devices and methods

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

July 15, 2014

Patent Application Number

13770909

Date Filed

February 19, 2013

Patent Citations Received

US Patent 12131984 Heterogeneous fan-out structure and method of manufacture

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US Patent 12125797 Package structure with fan-out feature

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US Patent 12125820 Through-dielectric vias for direct connection and method forming same

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US Patent 12132004 Semiconductor devices and methods of manufacture

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US Patent 11670519 Redistribution structures for semiconductor packages and methods of forming the same

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US Patent 11670601 Stacking via structures for stress reduction

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US Patent 11682626 Chamfered die of semiconductor package and method for forming the same

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US Patent 11682655 Semiconductor packages and methods of forming the same

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