US Patent 8786060 Semiconductor package integrated with conformal shield and antenna

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87860600

Patent Inventor Names

Chi-Sheng Chung0

Yung-I Yeh0

Kuo-Hsien Liao0

Han-Chee Yen0

Date of Patent

July 22, 2014

Patent Application Number

134649100

Date Filed

May 4, 2012

Patent Citations Received

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US Patent 12094843 Antenna in embedded wafer-level ball-grid array package

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US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip

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US Patent 11887938 Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same

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US Patent 11894306 Chip package

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US Patent 12062618 Chip package

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