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US Patent 8787711 Transceiver and interface for IC package

Patent 8787711 was granted and assigned to Samtec Inc on July, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Samtec Inc

Current Assignee

Samtec Inc

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87877110

Patent Inventor Names

Brian Vicich0

Jean-Marc André Verdiell0

John Mongold0

Keith Guetig0

Randall Musser0

Eric Zbinden0

Date of Patent

July 22, 2014

Patent Application Number

138955710

Date Filed

May 16, 2013

Patent Citations Received

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US Patent 12069778 Devices, systems and methods for electrical utility submetering

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US Patent 11764523 Very high speed, high density electrical interconnection system with impedance control in mating region

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US Patent 11842138 Integrated routing assembly and system using same

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US Patent 11996654 Controlled-impedance compliant cable termination

Patent Primary Examiner

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Sarah Hahm

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