US Patent 8791536 Stacked sensor packaging structure and method

Is a

Patent Jurisdiction

Patent Number

Patent Inventor Names

Larry Kinsman0

Yu Te Hsieh0

Date of Patent

July 29, 2014

Patent Application Number

133528440

Date Filed

January 18, 2012

Patent Citations Received

Patent Primary Examiner

No article content yet.

No Timeline data yet.

Title

Author

Link

Type

Date

No Further Resources data yet.

Find more entities like US Patent 8791536 Stacked sensor packaging structure and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.