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US Patent 8791562 Stack package and semiconductor package including the same

Patent 8791562 was granted and assigned to Samsung on July, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87915620

Patent Inventor Names

Yun-hyeok Im0

Jung-Hwan Kim0

Kwang-chul Choi0

Tae-hong Min0

Chung-sun Lee0

Eun-kyoung Choi0

Hyon-chol Kim0

Ji-hwan Hwang0

Date of Patent

July 29, 2014

Patent Application Number

131836450

Date Filed

July 15, 2011

Patent Citations Received

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US Patent 11676873 Semiconductor package having sealant bridge

Patent Primary Examiner

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Cathy N. Lam

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