US Patent 8791574 Semiconductor device and manufacturing method of the same

Patent 8791574 was granted and assigned to Renesas Electronics on July, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Renesas Electronics

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87915740

Patent Inventor Names

Minoru Kimura0

Masao Odagiri0

Toshihiko Akiba0

Date of Patent

July 29, 2014

Patent Application Number

136130310

Date Filed

September 13, 2012

Patent Citations Received

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US Patent 11984410 Air channel formation in packaging process

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US Patent 12087618 Method for forming semiconductor die having edge with multiple gradients

Patent Primary Examiner

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S. V. Clark

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