US Patent 8797057 Testing of semiconductor chips with microbumps
Patent 8797057 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 11, 2011
Date of Patent
August 5, 2014
Patent Application Number
13025931
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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