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US Patent 8802504 3D packages and methods for forming the same

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Wen Hsin Wei0

Wen-Chih Chiou0

Bruce C. S. Chou0

Ping-Kang Huang0

Sao-Ling Chiu0

Shang-Yun Hou0

Shin-Puu Jeng0

Date of Patent

August 12, 2014

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Patent Application Number

139389390

Date Filed

July 10, 2013

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Patent Citations Received

US Patent 12137566 Peripheral circuitry under array memory device and method of fabricating thereof

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US Patent 12068285 Stacked die structure and method of fabricating the same

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US Patent 12068297 Hybrid integrated circuit package

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US Patent 12074101 Package structure and method of fabricating the same

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US Patent 12074136 Package structure and method of manufacturing the same

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US Patent 12080681 Package structure and method of fabricating the same

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Patent Primary Examiner

Kevin M. Picardat

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