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US Patent 8803206 3D semiconductor device and structure

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

August 12, 2014

Patent Application Number

13855786

Date Filed

April 3, 2013

Patent Citations Received

US Patent 12069856 Methods of forming electronic devices using materials removable at different temperatures

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US Patent 11756822 3D semiconductor device and structure including power distribution grids

US Patent 11791331 Integrated circuit structures including backside vias

US Patent 12028978 Resilient micro lattice electrical interconnection assembly

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US Patent 11705663 Outdoor power supply system with a protective connection system

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