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US Patent 8803269 Wafer scale packaging platform for transceivers
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Patent
Date Filed
May 3, 2012
Date of Patent
August 12, 2014
Patent Application Number
13463408
Patent Citations Received
US Patent 12124087 Wideband surface coupling
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US Patent 11782225 Multi-fiber interface apparatus for photonic integrated circuit
US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
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US Patent 11852876 Optical coupling
0
Patent Inventor Names
Bipin Dama
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Kaushik Patel
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Kishor Desai
0
Mark Webster
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Prakash Gothoskar
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Rao V. Yelamarty
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Ravinder Kachru
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Soham Pathak
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Thomas Daugherty
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Vipulkumar Patel
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
8803269
Patent Primary Examiner
Ida M. Soward
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