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US Patent 8821779 Method of molding a microneedle

Patent 8821779 was granted and assigned to 3M on September, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8821779

Patent Inventor Names

Dennis E. Ferguson0

Donald L. Pochardt0

Satinder K. Nayar0

Date of Patent

September 2, 2014

Patent Application Number

13549694

Date Filed

July 16, 2012

Patent Citations Received

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US Patent 11744927 Dissolvable microneedle arrays for transdermal delivery to human skin

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US Patent 11744889 Skin microenvironment targeted delivery for promoting immune and other responses

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US Patent 11877848 Dermal patch for collecting a physiological sample

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US Patent 11964121 Mono dose dermal patch for pharmaceutical delivery

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US Patent 12023156 Dermal patch for collecting a physiological sample

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US Patent 11672964 Bioactive components conjugated to substrates of microneedle arrays

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Patent Primary Examiner

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Jill Heitbrink

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