US Patent 8830689 Interposer-embedded printed circuit board

Patent 8830689 was granted and assigned to Samsung on September, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88306890

Patent Inventor Names

Young Do Kweon0

Young Ho Kim0

Hee Kon Lee0

Jin Gu Kim0

Mi Jin Park0

Seung Wook Park0

Date of Patent

September 9, 2014

Patent Application Number

132338510

Date Filed

September 15, 2011

Patent Citations Received

‌

US Patent 11956897 Semiconductor package device and method of manufacturing the same

Patent Primary Examiner

‌

Hoa C Nguyen

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