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US Patent 8836136 Package-on-package assembly with wire bond vias

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Reynaldo Co0

Roseann Alatorre0

Se Young Yang0

Wei-Shun Wang0

Zhijun Zhao0

Ellis Chau0

Philip Damberg0

Date of Patent

September 16, 2014

Patent Application Number

13405108

Date Filed

February 24, 2012

Patent Citations Received

US Patent 12107082 Offset interposers for large-bottom packages and large-die package-on-package structures

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US Patent 11837556 Wire bonding method and apparatus for electromagnetic interference shielding

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US Patent 11978730 Offset interposers for large-bottom packages and large-die package-on-package structures

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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate

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