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US Patent 8866308 High density interconnect device and method

Patent 8866308 was granted and assigned to Intel on October, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8866308

Patent Inventor Names

Mihir K Roy0

Mathew J Manusharow0

Date of Patent

October 21, 2014

Patent Application Number

13722128

Date Filed

December 20, 2012

Patent Citations Received

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US Patent 12107042 Localized high density substrate routing

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US Patent 11694952 Horizontal pitch translation using embedded bridge dies

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US Patent 11984396 Localized high density substrate routing

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US Patent 12087596 Controlling of height of high-density interconnection structure on substrate

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US Patent 12094831 High density interconnect device and method

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US Patent 11664320 High density interconnect device and method

Patent Primary Examiner

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Jasmine Clark

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