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US Patent 8871641 Low resistance through-wafer via

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 3, 2012
Date of Patent
October 28, 2014
Patent Application Number
13692303
Patent Citations Received
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US Patent 12131985 Hermetic metallized via with improved reliability
0
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US Patent 11760682 Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
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US Patent 11972993 Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
0
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US Patent 12009225 Electrically conductive vias and methods for producing same
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Patent Inventor Names
Peter Nilsson
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8871641
Patent Primary Examiner
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(Vikki) Hoa B Trinh

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