US Patent 8872349 Bridge interconnect with air gap in package assembly

Patent 8872349 was granted and assigned to Intel on October, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88723490

Patent Inventor Names

Mathew J. Manusharow0

Chia-Pin Chiu0

Zhiguo Qian0

Date of Patent

October 28, 2014

Patent Application Number

136107800

Date Filed

September 11, 2012

Patent Citations Received

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US Patent 12087596 Controlling of height of high-density interconnection structure on substrate

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US Patent 12132002 Bridge interconnection with layered interconnect structures

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US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip

Patent Primary Examiner

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Nitin Parekh

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