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US Patent 8884350 Semiconductor device
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Edits on 12 Jan, 2024
"update inverses"
Golden AI
edited on 12 Jan, 2024
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Patent Citations Received
US Patent 11869932 Manufacturing method of capacitive structure, and capacitor
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"update inverses"
Golden AI
edited on 12 Jan, 2024
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Patent Citations Received
US Patent 11869930 Method for forming semiconductor structure and semiconductor structure
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Edits on 11 Oct, 2023
"update inverses"
Golden AI
edited on 11 Oct, 2023
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+1
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Patent Citations Received
US Patent 11784216 Manufacturing method of capacitive structure, and capacitor
Edits on 27 Sep, 2023
"Add patent inventor(s)"
Golden AI
edited on 27 Sep, 2023
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Patent Inventor Names
Toshiyuki Hirota
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Edits on 26 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 26 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=08884350
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Edits on 24 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 24 May, 2023
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US Patent 08884350 Semiconductor device
US Patent 8884350 Semiconductor device
Infobox
Patent Number
08884350
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Patent Number
8884350
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Edits on 6 Apr, 2023
"Entity importer update"
Golden AI
edited on 6 Apr, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
08884350
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Date of Patent
November 11, 2014
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Patent Application Number
13748191
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Date Filed
January 23, 2013
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=08884350
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Patent Primary Examiner
Dao H Nguyen
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Edits on 15 Jun, 2022
"Entity importer update"
Golden AI
edited on 15 Jun, 2022
Edits made to:
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+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08884350
Edits on 27 Dec, 2021
"Created via: Entity Importer"
Golden AI
created this topic on 27 Dec, 2021
Edits made to:
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+7
properties)
US Patent 08884350 Semiconductor device
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
08884350
Date of patent
November 11, 2014
Patent application number
13748191
Date Filed
January 23, 2013
Patent primary examiner
Dao H Nguyen
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